A Cost-Based Allocation of Inspection Efforts in Quality Control of a Multistage Assembly Line: A Case Study of an Electronics Assembly Line
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Issue section:
Research
Keywords:
Electronics Assembly, SMT line, Quality Control, Cost based optimization of inspection effort
Abstract
Firms within the electronics manufacturing industry is often a high-volume high-mix product manufacturing industry. This study presents a cost-based allocation of inspection efforts in quality control of a sequential multi-stage electronic assembly line, considering all relevant costs and proposes the optimum inspection strategy. A dynamic sampling plan is incorporated in the model to maintain the desired quality levels. Monte-Carlo simulation is used to obtain the solution of this complex model. The model is created based on an actual electronics packaging company. This approach provides the ability to minimize the costs and does not sacrifice the quality of the products. The input factors that significantly affect the costs are identified so that they can be optimized for performance improvement and decision-making.
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Published
December 30, 2019
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Bowling, S. R., Khasawneh, M. T., Kaewkuekool, S., & Cho, B. R. (2004). A Markovian approach to determining optimum process target levels for a multi-stage serial production system. European Journal of Operational Research, 159, 636-650.
Buttars, S. P. (1993). Parameters for solder paste printing for fine pitch components. Proceedings- NEPCON West '93, Anaheim, California, 3, 1254-1265.
Direct Industry. (Photographer) (2014). SMT pick & place machine [Web]. Retrieved from http://www.directindustry.com/prod/europlacer/smt-pick-place-machines-55695-363829.html
Finkelshtein, A., Herer, Y. T., Raz, T., & Ben-Gal, I. (2005). Economic optimization of off-line inspection in a process subject to failure and recovery. IIE Transactions, 37(11), 995-1009.
Heredia-Langner, A., & Montgomery, W. M. (2010). Solving a multistage partial inspection problem using genetic algorithms. International Journal of Production Research, 40(8), 1923-1940.
Huang, J. C. Y. (2010). Reducing solder paste inspection in surface-mount assembly through Mahalanobis–Taguchi analysis. Electronics Packaging Manufacturing, IEEE Transactions, 33(4), Retrieved from http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=5559398&url=http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5559398
Hwang, J. S. (2004). Solder technologies for electronic packaging and assembly. In C. Harper & R. M. Sampson (Eds.), Electronic Materials and Processes Handbook.
IPTE. (Photographer) (2014). Bare board loader (BBL)[Web]. Retrieved from http://www.ipte.com/systems/conveying/loaders-unloaders/bbl/
Kakade, V., Valenzuela, J. F., & Smith, J. S. (2004). An optimization model for selective inspection in serial manufacturing systems. International Journal of Production Research, 42(18), 3891-3909.
Lee, J., & Unnikrishnan, S. (1998). Planning quality inspection operations in multistage manufacturing systems with inspection errors. International Journal of Production Research, 36(1), 141-156.
Li, M. C., Al-Refaie, A., & Yang, C. (2008). DMAIC approach to improve the capability of SMT solder printing process. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 31(2), 126-133.
Linkwitz, S. (Photographer) (2014). Woofer - analog signal processor [Web]. Retrieved from http://www.linkwitzlab.com/Pluto/woofer-asp.htm
Penn, M., & Raviv, T. (2008). A polynomial time algorithm for solving a quality control station configuration problem. Discrete Applied Mathematics, 156, 412-419.
Raz, T., Herer, Y. T., & Grosfeld-Nir, A. (2007). Economic optimization of off-line inspection. IIE Transactions, 32(3).
Recon Sales Group (Videographer) (2013). Nutek vacuum style bare board loader [Theater]. Available from http://www.youtube.com/watch?v=kBqYx1JPFGo
Sadegheih, A. (2007). Sequence optimization and design of allocation using GA and SA. Applied Mathematics and Computation, 186, 1723-1730.
Sankarasubbu, K. G. (2011). Design of an information system for quality assurance at an EMS provider: A case study. (Master's thesis, Binghamton University State University of New York).
Shea, C. (2012, May 7). Troubleshooting the stencil printing process. Retrieved from www.smta.org/../Houston_Troubleshooting_The_Stencil_Printing_Process _-_Chrys_Shea.pdf
Shetwan, A. G., Vitanov, V. I., & Tjahjono, B. (2011). Allocation of quality control stations in multistage manufacturing systems. Computers & Industrial Engineering, 60, 473-484.
Shiau, Y. (2002). Inspection resource assignment. International Journal of Production Research, 40(8), 1787-1806.
Syrus, T., & Pecht, M. G. (2001). Manufacturer assessment procedure and criteria for parts selection and management. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 24(4), 351-358. Retrieved from http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=980045
Tummala, R. (2004). Fundamentals of microsystems packaging.
Van Volsem, S., Dullaert, W., & Van Landeghem, H. (2007). An evolutionary algorithm and discrete event simulation for optimizing inspection strategies for multi-stage processes. European Journal of Operational Research, 179, 621-633.
How to Cite
A Cost-Based Allocation of Inspection Efforts in Quality Control of a Multistage Assembly Line: A Case Study of an Electronics Assembly Line . (2019). Industrial and Systems Engineering Review, 7(2), 125-146. https://doi.org/10.37266/ISER.2019v7i2.pp125-146
How to Cite
A Cost-Based Allocation of Inspection Efforts in Quality Control of a Multistage Assembly Line: A Case Study of an Electronics Assembly Line . (2019). Industrial and Systems Engineering Review, 7(2), 125-146. https://doi.org/10.37266/ISER.2019v7i2.pp125-146
